Innovators creating the future together!
Leveraging decades of experience to bring products to market
The Essence of Innovation Impact Partners
At IIP we approach the innovation journey holistically, collaborating across all areas essential for the successful commercialization of the new technologies.
- VISION & PURPOSE
- LEADING & MANAGING
- STRATEGY & EXECUTION
- CREATIVITY & DISCIPLINE
- HUMAN CAPITAL & DIGITALIZATION
- ORGANIZATIONAL STRUCTURE & CULTURE
- TALENT & TEAMWORK
- PRODUCTS & PROCESS
- EXPLOITATION & EXPLORATION
- IP STRATEGY & COLLABORATION
- TECHNOLOGY & CUSTOMER FOCUS
Our Engagement Models
Collaboration for Innovation
Helping bring your new technologies to market faster with a higher return on investment. Our Sherpa model instills confidence in your successful new product launches with sustained business value.
Our goal is to make
your journey easier!
Advanced Manufacturing Technologies
Scale-up and commercialization of the most advanced and demanding new materials to enable your success. Driving innovations in advanced manufacturing technologies to enhance time-to-market, quality and reliability.
Innovators creating the
future together!
Knowledge in
Action
Building and upskilling talent for the semiconductor industry. We provide the workforce training you require to enable your next generation of innovators and leaders to succeed.
Knowledge is potential,
Applied Knowledge creates!
Our Core Values
Innovation
We push the boundaries of the norm, encourage curiosity, constantly raise the bar, and always strive to exceed expectations.
speed
We understand time is precious. We make data-driven decisions quickly and execute them with intensity.
growth
We continuously aim to grow as individuals and as a company.
creativity
We challenge the status quo and encourage thoughtful, meaningful and inspirational ideas.
collaboration
We achieve more when we collaborate and work together as a team with integrity and purpose.
about IIP
Mark O’Neill, Ph.D.
Founder + CEO
Founder & CEO of Innovation Impact Partners, Dr. Mark O’Neill gained more than 25 years of industrial experience in the creation, development, commercialization, and value maximization across all segments of advanced materials and technology for semiconductor manufacturing.
Mark was team lead that discovered and commercialized porous extreme low dielectric constant materials for interconnect manufacturing. As a Global Technology Director of a Deposition Materials Division, he led the new product development for the first low temperature silicon oxide atomic layer deposition family of products. He also gained extensive experience as the Global Technology Director for Planarization Materials, developing high performance chemical mechanical planarization slurries. Most recently Mark served as Chief Technology Officer for one of the world’s largest and most diverse semiconductor materials businesses, including specialty gases and advanced patterning technology. He currently has co-authored more than 70 patent families, published and presented more than 50 papers, and has delivered multiple invited talks at international symposia focused on new materials and processes for semiconductor manufacturing.
